TEC-SPEED 20.0 – Dk 3.48

NO MORE COMPROMISES – PERFORMANCE, PRICE & AVAILABILITY

TEC-SPEED 20.0

KEY FEATURES

Dk: 3.48
Df: 0.0037
Tg: 280°C
Td: 392°C
Z-axis CTE: 31 ppm/°C
X/Y-axis CTE: 10/11 ppm/°C
Peel strength: 1.05 N/mm
IPC 4103 /11
PP/Bondply available

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CERAMIC-FILLED HYDROCARBON THERMOSET MATERIAL

TEC-SPEED 20.0 (VT-870) is a high frequency laminate designed to preserve signal integrity up to high-GHz frequencies and has extremely low 3.48 Dk and 0.0037 Df. By minimizing insertion losses, TEC-SPEED 20.0 gives you more freedom to optimize copper trace widths, spacing, and PCB thickness to suit your application.

Tested according to IPC-TM-650 specifications – the industry’s gold-standard – TEC-SPEED 20.0 is UL-approved, reliable and durable, offering outstanding thermal performance. High glass transition temperature (Tg), high peel strength, and low CTE ensure structural integrity, even in hardworking, high-speed circuits.

TEC-SPEED 20.0 is available as laminate (VT-870) or prepreg (VT-870PP), and with standard HTE copper foil or HVLP (Hyper Very Low Profile) foil used to attenuate passive intermodulation (PIM) effects.

TECHNICAL & LOGISTICS SUPPORT FROM VENTEC’S GLOBAL SERVICE NETWORK

TEC-SPEED 20.0 ceramic-filled hydrocarbon thermoset material is manufactured by Ventec using strict quality controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, is backed by a fully controlled and managed global supply chain, sales- and support-network.